Experience Molding Intelligence at the Moldex3D Symposium

Don’t miss this chance to connect with experts from GM, BASF, Molex, Moldex3D, and more. We’ll dive deep into AI-driven automation, advanced materials, and the future of precision simulation.

Key Takeaways

• Next-Gen Tech: AI, Automation, and Optimization in molding (Moldex3D).

• High Performance: Integrated SMC simulation (GM) and fiber morphology (BASF).

• Precision Design: Conformal cooling (NyproMold) and thermal management for cold decks (Saint-Gobain).

• Reality Check: Accuracy in thin-wall parts (Molex) and tooling verification (Moldex3D).

• Thermal Accuracy: Enhanced simulation for thermal pins (TE).

• Smart Electronics: Moving beyond standard FEA for plastics (Cadence).

• Intelligent Workflow: AI-powered design improvement (Empower Operations).

• Engineering Innovation: Material insights driven engineering (CMTech).

Admission is complimentary. Please refer to our website for further updates and detailed event information.