Leading industry professionals and experts from across the supply chain will gather in Chicago at the Westin Chicago North Shore on June 18-19, 2019 for the Thin Wall Packaging conference, organized by specialist plastics industry consultancy AMI.
Now in its eighth year, Thin Wall Packaging provides a networking opportunity and a forum to discuss technology advancements and material science in the evolving market for cups, tubs, trays and containers. Processes and packs are being redesigned for optimum product quality, safety, cost and environmental impact. These complex demands are opening opportunities for innovative thermoforming, injection molding and IML, and new ways to address recyclability and end of life management.
Featuring a diverse program of presentations, the focus for Thin Wall Packaging 2019 will be on innovation, sustainability, adding value and optimizing performance across the supply chain. The conference will open with AMI Consulting sharing the latest opportunities in high barrier thin wall packaging, followed by the Foodservice Packaging Institute’s overview of trends in the large and growing foodservice market.
Developments in food preservation technologies such as high-pressure processing (HPP) and microwave active packaging will also be in the spotlight for 2019. Bemis North America will explore ways to enhance quality and shelf life of ready meals, leading HPP equipment supplier Hiperbaric USA will discuss technical pack requirements for high pressure processing, and microwave shielding specialists Shieltronics will explore the use of microwave active packaging through IML.
Delegates will hear about strategic challenges and opportunities for more sustainable thin wall packaging from S&P Global. After, Verstraete In Mold Labels and Kuraray America will share insights into the latest products designed for a circular economy. Wrapping up the sustainability session, the United States Department of Agriculture will give an overview of its BioPreferred program, which encourages the use of bio-based packaging for food uses.
Market leaders including Tech II, Sonoco, Mold & Robotics Group and Trexel will talk about ways to improve process efficiencies, quality and enhance brand value. The Thin Wall Packaging 2019 program also will look at advancements in materials and inspection of high barrier and multilayer materials, presented by Soarus and Intravis.
In addition to the two-day program of expert presentations, Thin Wall Packaging 2019 also provides a platform to meet with likeminded professionals from leading companies and organizations at all levels of the supply chain. For more information, visit www.ami.international.