ASACLEAN Introduces Next-Generation Purging Compound
The UF2 grade purging compound from ASACLEAN™, Parsippany, New Jersey, is ideal for blown and cast film extrusion applications, as well as injection molding. It enables faster changeovers for reduced equipment downtime, resulting in increased productivity and greater cost savings for plastics manufacturers.
The purging compound is recommended for color changes, material changes, hot runner cleaning and shutdown/sealing. Use of UF2 requires less product than competing products and results in quicker cleanup. For blown film applications, UF2 Grade purging compound also helps manufacturers “hold the bubble,” minimizing downtime to increase productivity.
For blow molding applications, UF2 helps hold the parison. With a processing temperature range of 170-320°C (340-610°F), ASACLEAN’s UF2 Grade requires 0.0004" (0.01mm) clearance for hot runner gates and extrusion dies. UF2 grade can pass through as tight as 200-mesh extrusion screen packs when only one layer of mesh is used.
For more information, visit www.asaclean.com.